Advanced Sensor Packaging
Our Silicon Photonic chips come with advanced packaging techniques which ensure hassle-free connection to the external world of electronics for data processing. They are also packaged to reduce the effects of humidity when working in the real-time environment.

Higher Rate of Detection at lower sample rate.
Can be customized to fit more advanced features on chip.
Easily be scaled up in the market to serve different use cases.
Can reduce power consumption levels from few 1000’s of watts to few 10’s of milli Watts.


